Power semiconductor module having a plurality of semiconductor arrangements

US5459356A · kind A · utility

Assignees

• EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · DE
• Siemens Aktiengesellschaft · DE

Inventors

• Gerhard Schulze · Lippstadt, DE
• Karl-Heinz Sommer · Stockdorf, DE
• Reinhold Spanke · Bestwig, DE
• Gyoergy Papp · Erlangen, DE
• Walter Springmann · Höchstadt an der Aisch, DE
• Peter Zwanziger · Nuremberg, DE

Key dates

• Filing date: Feb 16, 1995
• Grant date: Oct 17, 1995
• Expiry date: Feb 16, 2015

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A plurality of semiconductor arrangements arranged on interconnects are cected parallel to one another in a module. The arrangements lie opposite one another in pairs. At least one pair and at most two pairs of semiconductor arrangements are arranged to follow one another in the direction of an axis of the module and are further connected to lead conductors. Positions of the lead conductors with respect to the contacted semiconductor arrangements are the same for each pair of semiconductor arrangements or, respectively, two respective pairs of semiconductor arrangements. Corresponding lead conductors are connected to one another above the interconnects.