Semiconductor device with heat radiating fin assembly and container for housing the same
US5459638A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 14, 1994 |
| Grant date | Oct 17, 1995 |
| Priority date | — |
| Expiry date | Dec 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided with a rectangular package body, a large number of leads projecting out from the body, and a heat radiating fin assembly on top of the package body. The heat radiating fin assembly is constructed of a support column extending vertically from the top surface of the package body and at least one heat radiating fin extending outwardly from the support column in a radial direction. The heat radiating fin is supported by direct or indirect engagement within a container for accommodating and holding the semiconductor device. The support is achieved in such a way that the leads of the device are held out of contact with the inside of the container and such that the device is accommodated and held within the container in a predetermined orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.