Method for fabricating electrode patterns
US5460922A · kind A · utility
14Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1994 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | Jul 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/60
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of forming electrode patterns on a substrate. A substrate (30) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (32) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then flood exposed to actinic radiation (19). The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.