Portable semiconductor device with resin
US5461256A · kind A · utility
47Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1993 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | Nov 3, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/284
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.