Semiconductor device socket
US5461258A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1993 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | Dec 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1023
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.