Process and device for hermetic encapsulation of electronic components
US5461545A · kind A · utility
98Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1994 |
| Grant date | Oct 24, 1995 |
| Priority date | — |
| Expiry date | Sep 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.