Electrically conductive adhesive
US5463190A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1994 |
| Grant date | Oct 31, 1995 |
| Priority date | — |
| Expiry date | Apr 4, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0425
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive adhesive (120) for electrically and mechanically bonding circuit terminals (105) includes a polymer (121) having a predetermined curing temperature range, a first conductive particulate material (125) suspendable in the polymer (121) for providing substantially uniform conductivity throughout the conductive adhesive (120), and a second conductive particulate material (130) suspendable in the polymer (121) for metallurgically bonding together particles of the first particulate material (125). The first conductive particulate material (125) provides substantially uniform conductivity throughout the conductive adhesive (120) and includes metallic particles having a melting point above the curing temperature of the polymer. The second conductive particulate material (130) welds together particles of the first particulate material (125) and includes metallic particles having a melting point within the curing temperature range of the polymer (121).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.