Method and apparatus for manufacturing of soldering rod containing copper
US5463886A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 6, 1991 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | May 6, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention concerns a process and an apparatus for manufacturing soldering rods with a copper percentage of at least 60 weight-%. An extruder serves to convert a block of the alloy at a temperature between 540.degree. and 680.degree. C. into an individual wire of a maximum diameter of 10 mm. Upon emerging from the extruder, the wire is chilled to a temperature below 250.degree. C. and either intermediately stored or directly further processed. Immediately following a conductive heating to temperature between 200.degree. and 280.degree. C., the wire is fed to a multi-stage reducing mill where it is reduced by rolling in each stage by a maximum of 25% until it has reached its final cross section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.