Spring clamp and heat sink assembly
US5464054A · kind A · utility
40Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1994 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | Aug 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting clip for securing a heat sink to a device package is secured to the heat sink by forming a groove in the heat sink, positioning the central body portion of the clip in the groove and deforming the wall of the groove to trap the clip in the groove. The clip is an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.