Resin transfer molding system
US5464337A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1994 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | Jul 7, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/256
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin transfer molding system including a sealable chamber having opposing flexible diaphragms forming an outer reconfigurable tooling surface and an inner surface surrounding a workpiece including fibrous reinforcing material to be impregnated and formed over a mold surface. There are means for impregnating the fibrous reinforcing material and means for compressing the diaphragms about the fibrous reinforcing material and for urging the compressed diaphragms and the fibrous reinforcing material contained therein over the mold surface to conform the compressed diaphragms and the fibrous reinforcing material to the contours of the mold surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.