Patent · US Expired

Dispersion-based heat-sealable coating

US5464494A · kind A · utility

12Cited by

4References

30Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Gerd Bolte · Monheim, DE
Guenter Henke · Neuss, DE
Ulrike Brueninghaus · Erkrath, DE

Key dates

Filing date	May 10, 1994
Grant date	Nov 7, 1995
Priority date	—
Expiry date	May 10, 2014

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/285
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Film-forming reactive systems for the surface-to-surface bonding and/or coating of substrates, more particularly for heat-sealable coatings are provided. The system is based on an aqueous dispersion of at least two epoxy-curable resins (I) and an epoxy compound as the curing component (II). The epoxy-curable resins are a polyurethane polymer containing epoxy-reactive functional groups present as the curable resin (Ia) and an aqueous dispersion of an acrylate and/or methacrylate homopolymer or copolymer containing carboxyl and/or methylol groups present as an additional curable resin (Ib). Also provided is a method for the production of laminates which employs the reactive system to bond substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.