Method of thickness control for dies
US5464577A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 1994 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | Jan 4, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An easily controllable method to adjust a die slot exit gap to produce an accurately controlled flow from the slot exit across the width of a die provides movable back seats at the back of the die that cause front and back portions of die plates to move simultaneously to produce a change in the die slot exit gap. At least one actuator is located between the front and back seats of the die to increase or reduce the actuator length to bend the first plate around the front seat thereby to increase or decrease the first exit gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.