Heat resistant resin compositions, articles and method
US5464949A · kind A · utility
17Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1993 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | Dec 21, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/929
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.