Chip-in-glass fluorescent indicator panel with heat protection
US5465027A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1993 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | Apr 30, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J31/15
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip-in-glass fluorescent indicator panel includes a glass substrate, a wiring layer, an insulating layer, a pattern-like graphite layer, a phosphor layer, a filament, a grid, an IC, an IC shield, a filament fixing portion, and an anchor. The wiring layer is formed on the glass substrate. The insulating layer covers the wiring layer. The pattern-like graphite layer is formed on the insulating layer to be electrically connected to the wiring layer. The phosphor layer is formed on the pattern-like graphite layer. The filament is suspended above phosphor layer with an interval. The grid is arranged between the filament and the phosphor layer. The IC is fixed on the insulating layer on one end side of the glass substrate to be connected to the pattern-like graphite layer through the wiring layer. The IC shield is arranged between the IC and the filament. The filament fixing portion is formed on the IC shield. The anchor is arranged on the insulating layer on the other end side of the glass substrate to suspend the filament between the anchor and the filament fixing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.