Process for producing a metal-ceramic substrate
US5465898A · kind A · utility
14Cited by
2References
12Claims
0Family size
Inventors
Key dates
| Filing date | May 31, 1994 |
| Grant date | Nov 14, 1995 |
| Priority date | — |
| Expiry date | May 31, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is provided where a ceramic metal substrate is produced by attaching metal foils on either side a ceramic layer to form metal layers and for producing a through connection by placing metal in an opening to form a bridge so that the metal layers are electrically connected together by direct bonding, and a metal body is inserted into the opening to almost fill it, while a surface of the metal body is provided with a layer with chemical compound of metal and reactive gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.