Method of simulating a seismic survey
US5466157A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1995 |
| Grant date | Nov 14, 1995 |
| Priority date | — |
| Expiry date | Feb 2, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V2210/66
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming a scale model for simulation of a seismic survey is disclosed. The model includes layers which are formed by way of stereolithography or similar methods, from a CAD data base; the precision of the formation of the layers allows for construction of the model without adhesives between all layers for structural integrity of the model, although adhesive or a wetting agent may be used, depending upon the desired simulation experiment. The model also includes molded layers which are poured, injected, or otherwise introduced in liquid form. The liquid may then be solidified, or may remain in liquid form, depending upon the survey. These molded layers may be made into the prefabricated layers where appropriate, or during the process of constructing the model. Simulation of the survey may be made by imparting acoustic energy thereinto and detecting the same. The disclosed method allows for iteration of the simulation in an efficient manner, as certain of the layers may be removed and replaced with others, due to the precision of the prefabrication process. Further iteration may efficiently be made by reconstruction of the entire model, due to the efficiency of the format…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.