Mark of an electronic component lid
US5466540A · kind A · utility
3Cited by
18References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1994 |
| Grant date | Nov 14, 1995 |
| Priority date | — |
| Expiry date | Feb 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12889
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of combining a metal component and a base metal of an article to form a pattern of the article. The method comprises applying the metal component to a carrier, the metal component shaped like the pattern; placing the metal component against the base metal; and supplying heat such that the base metal and the metal component alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.