Circuit boards including capacitive coupling for signal transmission and methods of use and manufacture
US5466892A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1993 |
| Grant date | Nov 14, 1995 |
| Priority date | — |
| Expiry date | Feb 3, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board and method of forming a circuit board with signal and receptor pads arranged on layers spaced apart in a Z direction with a dielectric layer therebetween, parameters of a resulting AC signal transmitting circuit resulting wherein: PA1 capacitive reactance is defined by the equation (I) ##EQU1## where F is frequency and C is capacitance; inductive reactance is defined by the equation (II) EQU X.sub.L =2.pi.FL where F is frequency and L is inductance; PA1 capacitance is defined by the equation (III) ##EQU2## where A is the effective mutual area of the signal and receptor pads, D is Faraday's constant, E is the dielectric constant, and .tau. is the thickness of the dielectric layer; and PA1 inductance is defined by the equation (IV) EQU L=0.005 ln (4h/d).mu.H/in. where ln indicates the natural logarithm for the value 4h/d, where h is the distance above a ground plane, and d is the equivalent diameter of a conductor; PA1 wherein capacitance and inductance are established in equations I and II with X.sub.C and X.sub.L being equal or approaching equality and the values of A, D, .tau., I.sub.N, h (etc.) are preselected or calculated from equations III and IV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.