Reflow soldering apparatus for soldering electronic parts to circuit substrate
US5467912A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1993 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Nov 23, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/012
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting whether or not a processing object is being conveyed into the apparatus is provided, so that the amount of inert gas to be supplied and the gas blowing speed are decreased when no processing object is present inside the apparatus. As a result, the amount of gas which flows out is made small, and a decrease in the temperature of the apparatus can be prevented. When the processing object is conveyed into the apparatus, the amount of supplied gas is increased so as to obtain a sufficient gas density. Thus, it is possible to prevent solder from being oxidized, and satisfactory solderability can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.