Solder ball supply device
US5467913A · kind A · utility
113Cited by
4References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 11, 1994 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Oct 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder ball supply device comprising flux supply means 200 which supplies flux at the same time to input and output terminals on substrate 1 prior to supply of solder balls, and solder ball supply means 300 which takes out a number of solder balls from discharger 350 in which solder balls are held matrixwise at the same time in the same pattern as the pattern of said input and output terminals and supplies solder balls to said input and output terminals to which flux has been supplied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.