Means for supporting and sealing the lead structure of a lamp and method for making such lamp
US5468168A · kind A · utility
17Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1994 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Sep 7, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01K1/38
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacture for a lamp involves making up, separate from an envelope, a sub-assembly comprising a lead structure and a vitreous body that surrounds it. In one form of this method, particles of vitreous material are pressed into a mold cavity that surrounds the lead structure, thus forming a compact surrounding the lead structure. This compact is sintered in an inert atmosphere, thereby forming the sub-assembly. Thereafter, the sub-assembly is placed in an opening in the envelope, and a hermetic seal is made between the envelope and the vitreous body in the interface region between the envelope and the vitreous body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.