Method for manufacturing semiconductor devices
US5468344A · kind A · utility
3Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1994 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a method for manufacturing semiconductor devices including a process of etching a member for use in making a semiconductor device. An improvement resides in a process for holding the member, using holding means which is placed into contact with the peripheries of the member, as well as forming a space including one face of the member, and a process for introducing a gas into the space, and blasting the gas from a clearance between the member and the holding means, as well as injecting an etching agent to the member from the opposite face side of the member to etch the other face of the member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.