Method of making a high-definition printed circuit
US5468345A · kind A · utility
0Cited by
2References
4Claims
0Family size
Inventors
Key dates
| Filing date | May 4, 1994 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | May 4, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making printed circuit boards in a continuous process. The method uses copper base metal sputtered onto a substrate. This base metal is much thinner than the base metal normally used in printed circuit processes and ultimately allows a greater number of conductors per unit of length to be made on the boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.