Integrated decoupling capacitive core for a printed circuit board and method of making same
US5469324A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1994 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Oct 7, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.