Heat sink header assembly
US5469330A · kind A · utility
Inventors
Key dates
| Filing date | May 23, 1995 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | May 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/366
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a header assembly, for interconnecting an electronic module to a mother board, including an insulating strip and at least one row of spaced-apart pins inserted through holes between an upper face and a lower face of the strip, each of the pins having an upper portion projecting from the upper face and being shaped and dimensioned to interconnect with the module, and a lower portion projecting from the lower face and being shaped and dimensioned to interconnect with the mother board, any adjacent two of the pins being separated by a length of the strip, the improvement which includes a plurality of collars of heat-dissipating material, one of the collars mounted around and in intimate contact with each of the pins, the collars having a peripheral outline shaped and dimensioned to avoid electrical contact with an adjacent pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.