Semiconductor device processing method
US5470392A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1994 |
| Grant date | Nov 28, 1995 |
| Priority date | — |
| Expiry date | Nov 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor processing method includes the steps of carrying a case containing semiconductor wafers and to which an ID card is attached into semiconductor processing equipment at a first side of the semiconductor processing equipment; removing the ID card from the case; taking the semiconductor wafers out of the case; carrying the semiconductor wafers taken out of the case into a processing means on a second side, opposite to the first side, of the semiconductor processing equipment; processing the semiconductor wafers in the processing means; attaching the ID card corresponding to the semiconductor wafers to the case; taking the processed semiconductor wafers out of the processing means at the first side of the semiconductor processing equipment; putting the processed semiconductor wafers into the case to which the ID card is attached; and carrying the case outside the semiconductor equipment at the first side of the semiconductor equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.