Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method
US5470411A · kind A · utility
22Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1993 |
| Grant date | Nov 28, 1995 |
| Priority date | — |
| Expiry date | Oct 25, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1737
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The method consists in pressure bonding a first strip to a second strip through a bonding press, marking each of the strips with the pattern pitches and juxtaposing the pattern pitch markings of each strip at the time of the bonding by extension of at least one strip with respect to another and by differential heating of each of the opposing strips to cause a relative shift, by expansion, of the two strips with respect to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.