Process for preparing high-adhesion and high-solubility poly (amide-imide-ester)
US5470936A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1993 |
| Grant date | Nov 28, 1995 |
| Priority date | — |
| Expiry date | May 28, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A high-solubility and high-adhesion poly(amide-imide-ester) resin prepared from a monomer composition comprising: (a) a diisocyanate such as diphenylmethane 4,4'diisocyanate; (b) a trimellitic anhydride; and (c) a bis-anhydride of trimellitic anhydride such as 1,2 bis(trimellitate)ethane dianhydride, dissolved in an appropriate solvent system. Each of the trimellitic anhydride and the bisanhydride of trimellitic anhydride constitutes 1 to 40%, on a molar basis, of the monomer composition and the amount of the diisocyanate is about 1.0 to 1.2 times, also on a molar basis, the sum of the trimellitic anhydride and the bis-anhydride of trimellitic anhydride. In an alternate embodiment, a fourth component (d) diacid such as isophthalic acid can be added to the monomer composition. After the polymerization reaction, the poly(amide-imide-ester) resin so produced can be diluted with a variety of organic solvents, such as xylene and dimethylacetamide, etc., and directly coated onto a copper foil to make polymer/metal laminates without going through an intermediate step involving polyamic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.