Metallurgical joint including a stress release layer
US5471092A · kind A · utility
48Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1994 |
| Grant date | Nov 28, 1995 |
| Priority date | — |
| Expiry date | Dec 21, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metallurgical joint structure between two workpieces to be joined by soldering or brazing includes a stress release layer of a low yield point metal, preferably silver, gold, copper, palladium or platinum. The joint structure also includes a juxtaposed barrier layer to prevent the diffusion of a solder element, such as tin, to the stress release layer. Preferred barrier layers are chromium, titanium-tungsten and tantalum. Preferably, the joint includes one or more stress relief layer and associated barrier layer combinations in the joint structure for improved joint reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.