Interconnection between layers of striplines or microstrip through cavity backed slot
US5471181A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 8, 1994 |
| Grant date | Nov 28, 1995 |
| Priority date | — |
| Expiry date | Mar 8, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/121
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An interconnection between layers of stripline or microstripline in a multilayer microwave circuit assembly, through electromagnetic coupling. The adjacent layers (52 and 54) utilize a common ground plane layer (56), and a U-shaped coupling slot (64) is formed in the common ground plane. To eliminate undesirable coupling to other transmission line modes, the coupling slot is enclosed by a cavity (70) for each layer. The cavity size is selected so that no cavity mode exists, and to prevent formation of unwanted transmission modes. The "U" shape of the slot reduces the size of the cavity. The interconnection can be used with adjacent layers of stripline, microstrip line, or stripline and microstrip line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.