High dissipation packaging for cryogenic integrated circuits
US5471844A · kind A · utility
25Cited by
16References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Nov 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaging apparatus used to store semiconductor devices with a coolant without contaminating the semiconductor devices. The apparatus has an enclosure which is evacuated at room temperature and then cooled in an atmosphere of coolant gas until the gas condenses and the enclosure is partially filled with liquid. The enclosure is then heated to allow the liquid to evaporate and a thermally activated mechanism to trap pure cold gas inside the enclosure. The trapped gas increases internal pressure which maintains a tight seal of the trapping mechanism against a gasket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.