Brushless electroforming apparatus
US5472587A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Feb 25, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus is disclosed for depositing metal on a mandrel which provides a brushless electrical current continuity between the mandrel and a current source, comprising: (a) a metal deposition vessel; (b) an electrode disposed in the vessel; (c) a mandrel disposed in the vessel, spaced apart from the electrode; (d) an electrically conductive liquid disposed in the vessel; (e) an electrolytic solution disposed in the tank; (f) a layer of a substantially electrically nonconductive material disposed between the electrolytic solution and the conductive liquid; and (g) connecting means for electrically connecting the mandrel and the conductive liquid, coupled to the mandrel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.