Method of adding particulate additives to metal particles
US5472661A · kind A · utility
25Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 16, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Dec 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12049
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method of distributing and retaining insoluble additive particles uniformly throughout a mass of moldable metal particles. The additive particles are suspended in a solution of a polymeric binder and spray-coated onto the metal particles. When the solvent evaporates, the additives remain glued to the metal particles by the binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.