Moisture-curable hot melt silicone pressure-sensitive adhesives
US5473026A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Jun 20, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J183/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A moisture-curable silicone hot melt pressure sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula --ZSiR.sup.1.sub.x (OR.sup.2).sub.3-x ; wherein R.sup.1 is a monovalent hydrocarbon radical, R.sup.2 is selected from the group consisting of a alkyl radical and alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25.degree. C. of 20 to <100,000 mm.sup.2 /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; and (C) sufficient catalyst to accelerate the cure of said composition; said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.