Shielded enclosure for housing electronic components and manufacturing method thereof
US5473111A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1993 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Sep 14, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49986
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An EMI protected enclosure and method of manufacture thereof. The enclosure is plastic and has an electromagnetic interference shield member disposed therein to protect the electronic parts or electronic equipment from electromagnetic interference. The electromagnetic interference shield member is exposed at the edges of the enclosure and can be formed into an electrical connector or otherwise connected to provide a ground for the enclosure. In the manufacturing method, the securing and shaping of the electromagnetic interference shield member by the closure of the molding dies eliminates the need for any pre-forming of the electromagnetic interference shield member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.