Printed circuit board with a coverlay film
US5473118A · kind A · utility
32Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Jun 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.