Method of treating an electrodeposited photosensitive resist to reduce water spotting
US5474666A · kind A · utility
1Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1993 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Nov 24, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/92
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Water spotting which occurs during rinsing of an electrodeposited photosensitive resist composition on a copper layer of a printed circuit board is reduced by applying an aqueous solution containing a surfactant. The surfactant is preferably a salt of an acylated polypeptide which is solid at ambient room temperature and forms a thin uniform film when the solution is dried.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.