Method of seeding diamond
US5474808A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 7, 1994 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Jan 7, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/27
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for seeding and growing diamond films on planar and non-planar surfaced substrates and also for patterning the diamond films include mixing submicron diameter diamond particles and binder particles in carriers such as photoresist or water, and applying the mixture to a substrate surface. Treatment of the substrate by chemical vapor deposition then removes the carrier and grows the dispersed diamond particles into a diamond film. Notably, diamond particles having an average size of 25 nanometers form a particularly desirable mixture since the particles do not tend to settle out of the mixture, and also since these particles result in smooth diamond films. The mixtures can be applied onto non-planar surfaces by spraying, dipping, or dispensing and jet writing, and can be applied to planar and non-planar surfaces as a complete coating, as a line, or as a pattern. Patterning of the mixture, either when applying the mixture to a substrate or after applying the mixture, allows the formation of novel structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.