Conductor-filled thermosetting resin
US5475048A · kind A · utility
31Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1993 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Dec 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.