Thick film hybrid multilayer circuit
US5475263A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1994 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Feb 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thick film hybrid multilayer circuit is provided in which circuit devices are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high component density. The circuit devices of the hybrid circuit are directly mounted to a substrate, with the multilayer conductor-dielectric structure being located on an opposite surface of the substrate so as to insulate the multilayer conductor-dielectric structure from the circuit devices. As such, the multilayer conductor-dielectric structure, which is inherently weaker than the substrate, is relatively insulated from the adverse effects caused by thermal cycling during the operation of the hybrid circuit, so as to reduce the likelihood of cracks developing in the dielectric material within the multilayer conductor-dielectric structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.