Arrangement having multilevel wiring structure used for electronic component module
US5475264A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1993 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Jul 28, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to this invention, there is provided a multilevel wiring substrate comprising, a base substrate having first and second surface and including first and second areas, said first area including first and second level conductive layers insulated from each other, a plurality of first vertical conductive layers electrically connected to said first level conductive layer so as to provide first end portions exposed to said first surface, and a plurality of second vertical conductive layers electrically connected to said second level conductive layer so as to provide second end portions exposed to said first surface, said first and second end portions being alternately arranged in row and column directions, and said second area including third and fourth conductive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.