Method of encapsulating optical components and products produced by that method
US5475784A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1995 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Jan 27, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4428
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of encapsulating an optical component, the component comprising at least partially uncoated organic material, the method comprising: placing molten metal around the optical component, and solidifying the metal. The invention includes encapsulating a segment or element of an optical component, such as, for example, an optical junction or a surface. An encapsulated optical component and optical components having sealed or encapsulated elements are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.