Method for making contact assembly
US5475921A · kind A · utility
48Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 1993 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Aug 4, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A contact assembly formed from an array of insulated resilient solid wires arranged in spaced apart side-by-side relation to each other and retained in assembly by an ultrasonically assembled two-part carrier strip which extends transversely of the wire array. Notches formed in the wires by grinding define exposed conductive surfaces at selected locations. The conductive surfaces are plated with precious metal to define contact surfaces on the wires which are formed to contact configurations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.