Superconducting multi-layer microstrip structure for multi-chip modules and microwave circuits
US5476719A · kind A · utility
19Cited by
24References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1994 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Aug 17, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-layer microstrip structure includes a substrate and a first superconducting layer deposited on the substrate. A first dielectric layer, made at least partially of benzocyclobutene (BCB), is deposited on the first superconducting layer. Additional superconducting dielectric and superconducting layers can be employed. Preferably the superconducting layers are made from niobium. The multilayer microstrip structure is ideally suited for use in passive circuit components of microwave circuits and in multi-chip modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.