Manufacture of electronic devices comprising thin-film circuits using a metal foil as a temporary support
US5476810A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 4, 1995 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Jan 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In manufacturing an electronic device comprising a thin-film circuit having semiconductor circuit elements (TFTs T1 & T2) processing limitations for the provision of the semiconductor film (1) and regions (5 & 6) of the semiconductor circuit elements are avoided by: PA1 (i) forming at least the thin-film semiconductive body or bodies (1) for the semiconductor circuit elements on a temporary support (10), and PA1 (ii) subsequently transferring it/them to the device substrate (20), e.g of an insulating polymer material. In a method in accordance with the invention, the temporary support is a metal foil (10) having opposite front and back faces (11 & 12) which are unattached over most of their area, the thin-film semiconductive body ( 1 ) is provided on the front face ( 11 ), and at least most of the metal foil (10) is etched away by etching into the back face (12) after the thin-film semiconductive body (1) is secured to the substrate (20). Very few processing steps are required for the provision, use and subsequent removal of such a simple temporary support (10), and it has advantageous properties when various device processing steps are carried out, e.g laser crystallisation and io…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.