Method of forming developer through-holes in a print head
US5477251A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1994 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Sep 12, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/4155
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This invention is directed to a method of forming developer through-holes in a print head which has a plurality of first electrodes and a plurality of second electrodes arranged in matrix with an insulating layer sandwiched therebetween. A main portion of each of the first electrodes is comprised of a couple of electrodes disposed in parallel with each other at a specified gap between them, and a main portion of each of the second electrodes is comprised of a couple of electrodes disposed in parallel with each other at a specified gap between them. An intersecting portion of each of the first electrodes and each of the second electrodes is irradiated with laser light to form a hole in the insulating layer. Thus, the gap between the parallel electrodes of each of the first electrodes, the hole formed in the insulating layer, and the gap between the parallel electrodes of each of the second electrodes together define a developer through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.