Process for producing the passivation layer of an active matrix substrate by back exposure
US5477355A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1993 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1362
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photoresist 10 is exposed to light from behind a substrate by using as photomask a wiring electrodes 2 and 4 and a switching element 8 which are individually composed of an opaque member, whereby a passivation layer 9 for the switching element 8 is patterned. By virtue of this method, a photomask becomes unnecessary and jogs of the passivation layer 9 can be formed outside the transparent pixel electrode 7. Therefore, an unsatisfactory orientation of a liquid crystal can be made invisible without enlarging the black matrix of a counter substrate. Furthermore, since a passivation layer can be removed in portions not requiring the passivation layer, image-sticking can be reduced and the quality of displayed picture can be greatly improved. The present invention makes it possible to reduce the number of photomasks used for production of an actively addressing substrate and improve the picture quality of a liquid crystal display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.