Process for forming polyimide-metal laminates
US5478462A · kind A · utility
253Cited by
7References
44Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.