Process for reducing the content of free fromaldehyde and formic acid in nonionic and anionic surfactants

US5478554A · kind A · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Ansgar Behler · Bottrop, DE
• Hermann Hensen · Haan, DE
• Uwe Ploog · Haan, DE
• Werner Seipel · Hilden, DE
• Frank Clasen · Hilden, DE

Key dates

• Filing date: Sep 23, 1994
• Grant date: Dec 26, 1995
• Expiry date: Sep 23, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D3/33
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A process for reducing the content of free formaldehyde and formic acid in nonionic and anionic surfactants is provided. The process comprises adding an amine compound selected from the group consisting of a) alkanolamines, b) aminocarboxylic acids and c) oligopeptides to a surfactant comprised of a member selected from the group consisting of nonionic and anionic surfactants. The amine compound is preferably selected from the group consisting of a) an alkanolamine containing 2 to 15 carbon atoms, b) an aminocarboxylic acid containing 2 to 8 carbon atoms, and c) an oligopeptide with an average molecular weight of 500 to 5000. The nonionic and anionic surfactants preferably contain 1 to 100 ethylene oxide units in the form of at least one polyethylene glycol chain. The amine compound is preferably added in a quantity of 50 to 6000 ppm, based on active substance of said surfactant.