Leadframe with pedestal
US5479050A · kind A · utility
36Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1994 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Oct 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A raised pedestal is formed on a leadframe die mount pad and is used in forming an electrical connection between the die bond pad and the semiconductor die, the electrical connection being isolated from the shear forces developed during temperature cycling or during thermal shock of the resultant semiconductor device. Such shear forces usually result in destruction of the bond between the semiconductor die and the die bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.